The Primo D-RIE® system, AMEC’s first-generation dielectric etch product, is a 300mm cluster tool that can be configured with up to three dual-station process modules (PM). Each PM allows two wafers to be processed simultaneously while in a single wafer processing environment. The product utilizes AMEC’s proprietary decoupled VHF and LF RF system plasma source, FEIS ring plasma confinement, and advanced kits to control the processing chamber environment. The Primo D-RIE system was designed for etch applications for all dielectric film stacks, including Silicon Oxide, Silicon Nitride and Low-k materials. Since its launch in 2007, Primo D-RIE has been deployed in leading fabs worldwide for its cost effectiveness and high performance in mass production.
Innovative solutions for semiconductor device fabrication at 65nm to 16nm nodes
Dual-station chamber design with more effective throughput
Independent process station RF system (bottom HF and LF) and end-point control systems
Proprietary RF match system
Proprietary plasma-confinement technology
High throughput with low cost of ownership (CoO)
Integrated strip capability and surface charge reduction capability (Primo iDEA® System)