Primo UD-RIE® is a high-end capacitive coupled plasma (CCP) etch system developed by AMEC based on its own IP. Specifically designed for the most critical high aspect ratio (HAR) dielectric etching process for memory device fabrication, Primo UD-RIE® features: Ultra low frequency, high-power RF system with multi-level pulsing function, effectively enhanced ion energy and directionality；Improved upper electrode cooling and heating design, along with an electrostatic chuck (ESC) resistant to high voltage to meet high RF power process requirement； Real time temperature switch enabled lower cathode with active by-zone temperature control (ATC) function , which improve etching performance at extreme edge of wafer and improve productivity；Optimized chamber coating compatible with novel corrosive etching gases, significantly widening the process window；Primo UD-RIE® adopts AMEC's pioneering active edge impedance tuning (AEIT) system. This technology for wafer edge plasma sheath control substantially enhance the tool's production performance. The system can be configured with maximum six single wafer etch reaction chambers and two photoresist strip chambers, providing flexible solutions for HAR etching. Primo UD-RIE® delivers superior performance in HAR etch for memory device manufacturing and has achieved large scale mass production in most critical applications.